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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-26
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filingDate 2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b25fca632f228a68c0c5a6fcac890154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26beb21b3ccd3fc9a65c99cf442b891b
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publicationDate 2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005112903-A
titleOfInvention Composite material, composite material molded body, and electronic component using the same
abstract Disclosed is a composite material having high toughness, good handling, excellent heat resistance and moisture resistance of a cured product, and excellent electrical characteristics. A liquid organic resin component that is liquid at a processing temperature, a solid organic resin component that has a molecular weight of 3000 or more and is a solid thermosetting resin at a processing temperature, and an inorganic powder. It is a composite material, and the liquid organic resin component is composed of a liquid thermosetting resin and / or a liquid curing agent, and the liquid organic resin component occupies 20 to 50 wt% of the entire organic resin component, A composite material, wherein the inorganic powder is 50 to 1600 parts by weight with respect to 100 parts by weight of the organic resin component. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007027353-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014179621-A
priorityDate 2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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