http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005112891-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate | 2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666680f5646defad712fcf627b36cc16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76396800c82b6f14876491ac4b33c4c3 |
| publicationDate | 2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005112891-A |
| titleOfInvention | Film substrate for semiconductor mounting |
| abstract | A film substrate for mounting a semiconductor capable of preventing cracks from being generated in a conductive material or a semiconductor chip and at the same time addressing a high-speed signal processing. A polyimide obtained by reacting an aromatic diamine having a benzoxazole structure with an aromatic tetracarboxylic acid anhydride in a film substrate for semiconductor mounting having one or more conductive layers. A film substrate for semiconductor mounting, characterized by using a film comprising: Preferably, in the above-mentioned film substrate for semiconductor mounting, the adhesive for bonding the conductive layer and the substrate has a specific tensile elastic modulus. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007254530-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007001174-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006348259-A |
| priorityDate | 2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 180.