| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d5ebd9bdc11f7a4b267d7e865d5a84f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
2004-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb3f609919e59a75d12d070d16367e0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aae9f6685b40610b5c0445493c3ed623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99b56dad2bd0a8d23b812260978934e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16f696dcf9a4cc2bb4c695ca5e7d80e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecf222a9f51dbfc6b71a3811dce2a6a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d379affca9a6b737826a1f57a76f6f6 |
| publicationDate |
2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005109456-A |
| titleOfInvention |
Manufacturing method of semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To realize a semi-multiple device manufacturing method capable of reducing variations in electrical characteristics and manufacturing a MOS semiconductor device with high quality and high yield. A semiconductor manufacturing method comprising a main body wafer manufacturing process for manufacturing a wafer for forming a semiconductor device as a product and a monitor wafer manufacturing process for manufacturing a wafer for forming a monitor element, wherein only the monitoring process is shared. The main body wafer manufacturing process includes a variation reducing process, and the monitor manufacturing process is a semiconductor manufacturing method including a performance observation process and a condition setting process. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007335677-A |
| priorityDate |
2003-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |