http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005108924-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_840c9af28dd1fb180afe92dd8c9415d0 |
| publicationDate | 2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005108924-A |
| titleOfInvention | Multilayer printed wiring board and manufacturing method thereof |
| abstract | PROBLEM TO BE SOLVED: To easily and accurately transfer a fine wiring pattern including a via hole in an interlayer insulating layer by an imprint method using a mold, and between miniaturized wiring patterns embedded in the interlayer insulating layer. Provided are a multilayer printed wiring board excellent in insulation and interlayer connectivity and a method for producing the same. An interlayer insulating material is formed by softening an interlayer insulating material formed on a core substrate and then softening a mold having convex portions corresponding to a concave portion for forming a wiring pattern and a concave portion for forming a via hole, respectively. The groove 14 for forming the wiring pattern and the groove 16 for forming the via hole are transferred by press-fitting into the layer. After heating or cooling to such an extent that the shape of these transferred grooves does not collapse, the mold is removed from the interlayer insulating layer. Thereafter, a conductor is filled in the transferred groove by plating or the like, thereby forming a wiring pattern and a via hole. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7724989-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100871093-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059452-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100792525-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009135415-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100887393-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007317857-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007074567-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4716819-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013051251-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007074567-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013038361-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019220547-A |
| priorityDate | 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.