| abstract |
Bleed of a liquid component derived from a side fill material can be suppressed, and the sealing performance is high and cured by controlling the penetration of the side fill material into the gap between the substrate and the semiconductor chip within an appropriate fixed range. Provided is a flip-chip side-fill material that provides a highly reliable semiconductor product with excellent crack resistance by the stress relaxation performance of an object. The content of (A) a liquid epoxy resin, (B) a curing agent, (C) an alkyl methacrylate copolymer, (D) particles having a particle size of 45 μm or more is 1% by mass or less, and average particles An inorganic filler having a diameter of 0.5 μm or more and less than 5 μm, (E) a surface treatment with a non-reactive organosilicon compound, and an average particle diameter of 0.01 to 0.10 μm And a semiconductor mounted on the substrate, comprising an inorganic filler, and (F) a modified epoxy resin, and a liquid epoxy resin composition having a viscosity at 25 ° C. of 100 Pa · s or more and less than 1000 Pa · s A side fill material for flip chip mounting of a semiconductor device including a chip. [Selection] Figure 1 |