http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005105022-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b472edeb5a42765a3f41d624e9f767b2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51b0c65a1a47314e8fe3f992d4a1d3ec |
| publicationDate | 2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005105022-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | An epoxy resin composition for sealing a semiconductor having excellent adhesion to a Ni pre-plating frame and a semiconductor device using the same. (A) An epoxy resin represented by the general formula (1), [Chemical 1] (In formula (1), R 1 is an alkyl group, or an allyl group having 1 to 4 carbon hydrogen or C, n represents 0 or an integer of 1 or more) (B) a phenol resin represented by the general formula (2), [Chemical 2] (In the formula (2) is R 2, R 3, R 4 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, it may be different be the same as each other. Further, n represents 0 or 1 or more Represents an integer) (C) inorganic filler, (D) An epoxy resin composition containing a curing accelerator as an essential component is prepared. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015520160-A |
| priorityDate | 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.