http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005103561-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eddf45580eb23b479a0cceea93a98607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_667ba8bf13bb484c6a71c931c41808ef
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publicationDate 2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005103561-A
titleOfInvention Solder supply method, solder supply apparatus, soldering method, and soldering apparatus
abstract PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of preventing a decrease in reliability of solder joint due to occurrence of a thread drawing phenomenon when soldering using a thread solder and supplying an appropriate amount of solder with high accuracy. The purpose is to provide. SOLUTION: A solder ball 11 is used as a solder material, and this is aligned and filled in a cylindrical member 12, and a certain amount is used by using members 13 and 14 for controlling the movement of the solder ball inside the cylindrical member. It captures and discharges it outside the cylindrical member. The released solder balls are heated and melted by a soldering iron or the like and used for soldering. When the solder balls are discharged, the flux can be added to and released from the solder balls at the same time. According to this, the corrosive action of the flux on the solder can be reduced. [Selection] Figure 3
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101043498-B1
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priorityDate 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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