| abstract |
PROBLEM TO BE SOLVED: To provide a practically useful polybenzoxazole, polybenzoxazole film and precursor thereof having solder heat resistance, relatively low dielectric constant, low linear thermal expansion coefficient, sufficient toughness, and thin film molding processability on a substrate. The manufacturing method of a body and a precursor is provided. SOLUTION: Two types of 3,3′-dihydroxybenzidine and 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane are used in combination as a bis (o-aminophenol) component, and as a dicarboxylic acid component Polybenzoxazole precursor that is polycondensed from terephthalic acid or trans 1,4-cyclohexanedicarboxylic acid. [Selection figure] None |