| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be92719b856db86c092cc233e9512ca2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0379
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0781
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13369
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2003-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1b83bb6b85bdce97c62fe76e047f9e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26d2105a30009a552da21559322693da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92e3341fb378e4044b7db761b240e05b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61730635c6d13a512d6dc1ced6bb88a8 |
| publicationDate |
2005-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005093826-A |
| titleOfInvention |
Connection structure using conductive adhesive and method for manufacturing the same |
| abstract |
PROBLEM TO BE SOLVED: To connect a first electric structure and a second electric structure with a conductive adhesive, and a special process is required by fusing metal fine particles at the interface of the electrode connection portion. Without making a "rigid connection" by heat curing treatment of the conductive adhesive. Conductivity is ensured by fusion of at least one of a first electrode provided in a first electrical structure and a second electrode provided in a second electrical structure and metal fine particles. And an intermediate connection portion in which conduction at an intermediate portion between the first electrode and the second electrode is ensured by a conductive adhesive, and the metal fine particles are formed by the conductive adhesive. The conductive adhesive is a conductive adhesive containing a conductive filler having a particle size that does not cause fusion below the heat curing temperature of the conductive adhesive. is there. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007165419-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007184408-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7816780-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006073550-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015087288-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8105687-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8222751-B2 |
| priorityDate |
2003-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |