http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005089841-A

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filingDate 2003-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47c976734aa6514ae56d10e0c78ab73b
publicationDate 2005-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005089841-A
titleOfInvention Method for detecting state of electroplating bath and electroplating apparatus
abstract PROBLEM TO BE SOLVED: To detect a composition variation of a plating bath in real time during precise electroplating, and to keep a good electroplated film by quickly responding to the composition variation such as supply of an additive. To be obtained. In electroplating an electronic device and an electronic device mounting substrate, a potential with respect to a reference electrode of a substrate cathode to be plated is detected in a predetermined period during the plating, and the variation of the potential is represented by a feature vector. This is compared with a predetermined characteristic pattern of potential fluctuation, and it is displayed which pattern is closest, and an alarm is issued when a pattern that is classified as abnormal is approached. [Selection] Figure 1
priorityDate 2003-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 21.