| abstract |
PROBLEM TO BE SOLVED: To short-circuit wiring for a thin film device and increase parasitic capacitance while suppressing a manufacturing cost when a thin tile device is attached on a substrate to constitute a thin film device (semiconductor device). Provided are a semiconductor element, a semiconductor device, a semiconductor element manufacturing method, a semiconductor device manufacturing method, and an electronic device that can be reduced. A semiconductor element 20 in which a semiconductor element 20 formed on a substrate is separated from the substrate into a micro tile shape, the tile portion 21a having a tile shape, and the electrode portion formed on the tile portion 21a. An insulating member for insulating from a desired member, and at least a part of the insulating member has an insulating layer 23 protruding from the outer edge of the tile portion 21a. [Selection] Figure 2 |