http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005079270-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9730310dc102bb568ea37cfc2321ecba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_befdaab17cf122cbce2f9b802c42ab69 |
publicationDate | 2005-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2005079270-A |
titleOfInvention | Heat resistant resin paste and flexible wiring board using the same |
abstract | PROBLEM TO BE SOLVED: To harden a plating layer without causing penetration of a plating solution component into an end portion of a surface protective film obtained by curing a heat-resistant resin paste, and without spreading a plating layer to a wiring pattern at the time of curing. It has excellent low warpage, flexibility, adhesion with sealing material, solvent resistance, chemical resistance, heat resistance, electrical properties, moisture resistance, etc. To provide a heat-resistant resin paste having excellent workability and economy. A heat resistant resin paste used as a surface protective film of a flexible wiring board in which all wiring pattern portions are plated, wherein (A) 100 parts by weight of heat resistant resin and (B) inorganic and / or A cured film containing 1 to 90 parts by weight of organic fine particles and heated at 110 to 130 ° C. for 5 to 15 minutes using a far infrared heating device has a tensile elastic modulus at 25 ° C. of 0.5 GPa or less, 25 A heat-resistant resin paste having a tensile elongation at 50 ° C. of 50% or more. [Selection figure] None |
priorityDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.