http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005079245-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_15d136214bdda2228cfd0a58b47015f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d75d1a4caed60a9316608ed9c231546c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cbccfa377fc6755d80db59d82c550ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fea6d0ab1e08bdd2ea47e941bb0d71cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_253fbdd3d6c7741ced7fb3ab3b7bf575 |
| publicationDate | 2005-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005079245-A |
| titleOfInvention | Metal wiring forming method and metal wiring forming apparatus |
| abstract | An object of the present invention is to reduce the amount of waste liquid and form a metal wiring with high resolution in a simple process and with a small number of processes. In a metal wiring forming method of forming a metal wiring on a substrate for an electronic circuit, the substrate for the electronic circuit is irradiated with a transparent laser beam on the substrate for the electronic circuit, and the electronic circuit A plasma is generated in the vicinity of the surface of the substrate on which the wiring is formed, and the plasma and the laser light applied to the electronic circuit substrate are allowed to interact with each other. Ablation is generated on the surface where the wiring is formed, and an etching groove is formed by ablation on the surface where the wiring is formed on the substrate for the electronic circuit, and a metal thin film is deposited on the bottom surface of the etching groove. The first stage and the second stage in which metal is deposited in the etching trench formed by the first stage. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8663754-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014165263-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11471981-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112010001125-T5 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019514207-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009231393-A |
| priorityDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.