http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005057173-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
filingDate | 2003-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bb56b3929c909cdd108796ac8ab71eb |
publicationDate | 2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2005057173-A |
titleOfInvention | Integrated circuit element |
abstract | The circuit scale of an integrated circuit increases year by year, and the inspection time keeps increasing as the scale increases. In addition, there are cases where the number of input / output pins required for the inspection requires a larger number of pins than the user uses, resulting in an increase in package and board costs. In order to solve the above problems, an integrated circuit device according to the present invention has devised a method in which test pins are arranged on the bottom surface having the same height as a package lead. The integrated circuit element comprises a sealing resin 1, a lead 2 used by a user, and a dedicated test pad 4 for a manufacturer's shipping inspection. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8963150-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109708765-A |
priorityDate | 2003-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
Total number of triples: 17.