http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005057173-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
filingDate 2003-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bb56b3929c909cdd108796ac8ab71eb
publicationDate 2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005057173-A
titleOfInvention Integrated circuit element
abstract The circuit scale of an integrated circuit increases year by year, and the inspection time keeps increasing as the scale increases. In addition, there are cases where the number of input / output pins required for the inspection requires a larger number of pins than the user uses, resulting in an increase in package and board costs. In order to solve the above problems, an integrated circuit device according to the present invention has devised a method in which test pins are arranged on the bottom surface having the same height as a package lead. The integrated circuit element comprises a sealing resin 1, a lead 2 used by a user, and a dedicated test pad 4 for a manufacturer's shipping inspection. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8963150-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109708765-A
priorityDate 2003-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 17.