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filingDate 2003-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41589ac1869ad135d89adacc75080959
publicationDate 2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005051151-A
titleOfInvention Method for manufacturing conductive layer, substrate having conductive layer, and electronic device
abstract 【Task】 Provided is a conductive layer forming method capable of selectively forming a conductive layer in a predetermined region without using etching as a patterning method. [Solution] The method for producing a conductive layer includes a first step of forming a self-assembled film having an affinity for the conductive material of the conductive layer in a conductive layer forming region on the surface of the substrate, and the self-assembling by electroless plating. A second step of depositing the conductive material on the textured film to form the conductive layer. In the second step, the pH of the electroless plating solution is preferably 7 or less, more preferably the electroless plating solution is acidic. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I467049-B
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101502995-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008192752-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7922887-B2
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Total number of triples: 36.