| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1619 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d84e95bcd5d85e5b783ef2e19e9300d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56273294d768a6eb535c01b3fbad53aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d0fe89890f0354e6185d0538cf0e25b |
| publicationDate |
2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005048209-A |
| titleOfInvention |
Electroless plating method, electroless plating apparatus, semiconductor device manufacturing method and manufacturing apparatus |
| abstract |
An object of the present invention is to reduce the amount of electroless plating solution used, facilitate the management of the composition of the plating solution, and prevent deterioration of the quality of the plating film due to dissolved oxygen. An electroless plating solution prepared in advance is exposed to a reduced-pressure atmosphere to reduce gas components present in the solution, and the electroless plating solution is maintained while keeping the electroless plating solution in a continuous thin liquid layer. An electroless plating method, wherein a surface to be plated of a substrate to be formed is brought into contact with the liquid layer and held for a desired time to perform an electroless plating process. Also disclosed are an electroless plating apparatus, a method for manufacturing a semiconductor device, and an apparatus therefor. [Selection] Figure 4 |
| priorityDate |
2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |