| abstract |
A method and apparatus for manufacturing a piezoelectric film structure for a MEMS device, in which a piezoelectric film formed on a substrate can be sufficiently protected from damage or contamination during the manufacturing process. A step of preparing a substrate 110, a step of forming a silicon oxide film 112 on both surfaces of the substrate, and then providing an opening 114 in the silicon oxide film on the back surface by photolithography, and a step of etching the back surface of the substrate to make fine Forming a recess 110e having a structure, and dropping the precursor solution onto the substrate front surface 110b while rotating the substrate mounted on the substrate holder 200 with the recess 110e facing downward, and forming a thin film layer on the surface; Consists of. [Selection] Figure 1 |