http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005029624-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2003-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb6073c88813a62a8dd512d80ad0ea4b |
| publicationDate | 2005-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005029624-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | To provide an epoxy resin composition for area mounting type semiconductor encapsulation having a small warp after molding or after soldering and having excellent reliability after soldering. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) fused spherical silica as essential components, wherein the fused spherical silica is a total epoxy resin. 85 to 95% by weight is blended in the composition, the median diameter of the fused spherical silica is 20 μm or more and 40 μm or less, and the blending ratio of particles having a particle size of less than 2 μm in the fused spherical silica is 20% by weight or less. An area mounting type semiconductor sealing epoxy resin composition, wherein the fused spherical silica has a specific surface area of 1 m 2 / g or more and 3 m 2 / g or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009102596-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011523398-A |
| priorityDate | 2003-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.