| abstract |
A thermally expandable microcapsule excellent in low temperature expandability is provided. Also provided is a low-temperature peelable and low-contamination adhesive tape using the present thermally expandable microcapsule. SOLUTION: At least one resin selected from the group consisting of a polyurethane resin, a polyester resin, a polyamide resin, and an epoxy resin, and a polymer (A) having a glass transition temperature of −40 ° C. to 70 ° C. as an outer shell. A thermally expandable microcapsule (C) that does not dissolve the polymer (A) and contains a solvent (B) having a boiling point of 50 ° C. or higher and 150 ° C. or lower is used. [Selection figure] None. |