http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005026548-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
filingDate | 2003-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c424ac3602d746ec43022410962f75b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbc9b959eb4073dcee8a5d9ce47dd27f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dd46db0642247cd8eb1d13f5835bf2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3126d23c20eaf0623c1d3a248c2e0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0dbb1edb46479cfc9b137ab4ca7169e |
publicationDate | 2005-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2005026548-A |
titleOfInvention | Manufacturing method of multi-wire wiring board |
abstract | A method for efficiently producing a multi-wire wiring board having high density and excellent reliability is provided. In a multi-wire wiring board comprising an insulation-coated wire as a part of a conductor layer, a connection hole at a necessary portion between the layers, and a conductor circuit provided on the surface when necessary, the following steps are performed. Including multi-wire wiring board manufacturing method. (A) A step of producing a multilayer wiring board 11 made of an insulating substrate, an adhesive sheet, and an insulating coated metal wire (b) a step of forming an uncured insulating adhesive layer on the surface of the multilayer wiring board 11 (c) a multilayer Step (d) of forming via holes in the insulating adhesive layer on the surface of the wiring board 11 (e) Step of filling a conductive material into the via holes formed on the surface of the multilayer wiring board 11 (e) Steps (a) to (d) The wiring board 16 manufactured in (1), the wiring board 11 manufactured in (a), a copper foil, or a copper-clad laminate are stacked and pressed and heated as necessary. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014199981-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014241201-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019030825-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200033874-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9966164-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102404116-B1 |
priorityDate | 2003-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.