| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2ed0897e087fa147bc2eb075dbc8b9c1 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate |
2003-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d060ef80aaea4c2c07322c206e94dc16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c27d61b3b908d3cc906808e59e9f9e15 |
| publicationDate |
2005-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005019886-A |
| titleOfInvention |
Polishing pad and its manufacturing method |
| abstract |
A polishing pad for a semiconductor wafer having a high polishing rate, a long life, and a high leveling ability and a method for manufacturing the same are provided. The fabric is made of a non-porous resin that fills the gaps between the constituent fibers of the fabric, and the fibers constituting the fabric have a cross-sectional area of 1 to 70 square microns and a tensile strength of 0 when dried. A polishing pad comprising a fiber made of a polymer material of 26 N / tex or more. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8011999-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110614580-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110614580-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010064216-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015137233-A1 |
| priorityDate |
2003-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |