| abstract |
[PROBLEMS] To provide excellent moldability, excellent appearance without wax bleeding and die marks at the gate portion, and resistance to cracking during soldering even when the surface mounting package sealing resin part absorbs moisture. Provided are an epoxy resin composition that gives an excellent cured product, and a semiconductor device encapsulated with the cured product of the resin composition. (A) an epoxy resin, (B) a curing agent, (C) sealed with an inorganic filler, and (D) (D1) an epoxy resin composition containing a molten mixture of a polyether-modified polysiloxane and (D2) a release agent, and a cured product of this epoxy resin composition Semiconductor device. [Selection figure] None |