http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005015583-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2003-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ee0780c3be5c2c9908ca8cfa480a270 |
| publicationDate | 2005-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005015583-A |
| titleOfInvention | Thermosetting resin composition epoxy resin composition and semiconductor device |
| abstract | To provide an epoxy resin composition that can cope with fine pitch formation in which leakage defects between leads and wires due to secondary aggregates of carbon black do not occur. An epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and (E) boron carbide. . |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022123924-A1 |
| priorityDate | 2003-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.