http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005012231-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2004-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01cd19963303720d983c66c36402f1e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95140663037e19701eae26904751e23b
publicationDate 2005-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005012231-A
titleOfInvention Cerium oxide abrasive and substrate polishing method
abstract PROBLEM TO BE SOLVED: To provide a cerium oxide abrasive that polishes a surface to be polished such as a SiO 2 insulating film without scratches. A SO wafer having a SiO 2 insulating film formed by TEOS-CVD is formed as a transmission electron. Slurry in which cerium oxide particles having a particle diameter aspect ratio of 1 or more and 2 or less and no contours containing no corners smaller than 120 ° C. as observed by a microscope are dispersed in a medium. Polish with abrasive. [Selection figure] None
priorityDate 2004-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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