abstract |
A semiconductor light emitting emitter package that combines a high emission output with heat protection. A semiconductor light package includes a lead frame, a semiconductor light emitting emitter, and an encapsulating portion. The lead frame 201 supports the semiconductor light emitting emitter 202 and provides a heat absorbing member 204 that provides a heat path for removing heat generated in the emitter 202 to the surrounding environment, and at least for electrically connecting to the semiconductor light emitting emitter 202. Two electric conducting wires 205 are provided. The encapsulating portion 203 covers the emitter 202 and the selective line junction 211 and protects them from damage. [Selection] Figure 2 |