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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f8cfa5aee4410611b5c562275c9f8e3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
filingDate 2003-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fae1e3aa96c0e563c390c37fb6ef2f29
publicationDate 2005-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005005001-A
titleOfInvention Conductive paste
abstract An object of the present invention is to uniformly disperse a metal fine powder contained in a conductive paste used for forming circuits on ICs, LSIs and other semiconductor elements, various electronic components or substrates, An object of the present invention is to provide a conductive paste capable of forming a fine and clear pattern by printing. The present invention provides the following repeating unit (1): [Chemical 1] (In the formula, R represents a hydrogen atom or a hydrocarbon group which may have 1 to 20 substituents, X represents an oxygen atom, a sulfur atom or a nitrogen atom; Including a combination of the above atoms, wherein m represents an integer of 4 to 10 and n represents an integer of 1 to 3). It is in. The present invention further provides the conductive paste as described above, wherein the resin constituting the conductive paste is a thermosetting resin. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009075162-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013155569-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9692325-B2
priorityDate 2003-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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