| abstract |
The present invention provides electrical connections and semiconductor devices (chip size or chip scale package ("CSP"), ball grid array ("BGA"), land grid array ("LGA"), etc., each having a semiconductor chip. Encloses the space between a large-scale integrated IC ("LSI"), such as a flip-chip assembly ("FC"), or a semiconductor chip itself and the circuit board to which the device or chip is each electrically interconnected. And an underfill composition for flux treatment, which is useful for flux treatment of a metal surface in the preparation of an underfill composition. The fluxing underfill composition of the present invention begins to cure at about the same temperature as the solder used to establish the electrical interconnections melts. |