| abstract |
Novel applications of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include thermal conductive films for integrated circuit packages, low k dielectric layers for integrated circuit multilayer wiring, thermally conductive adhesive films, thermal conductive films for thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission. Including, but not limited to, a cathode. The diamondoids used in the present invention may be selected from lower diamondoids as well as recently provided higher diamondoids, including substituted and unsubstituted diamondoids. Higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be processed as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite. |