http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004521186-A

Outgoing Links

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filingDate 2001-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2004-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004521186-A
titleOfInvention Plating method and apparatus for creating a difference between a top surface of a workpiece and an additive deposited on a cavity surface using external influences
abstract The present invention relates to a method and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The present invention removes at least one additive adsorbed on the top of the workpiece more than at least one additive located on the cavity portion, so that the additive is completely removed on the top. Allow plating of the conductive material to occur before re-adsorption, so that more plating occurs in the cavity than at the top.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101687462-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013125658-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140112559-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013125658-A1
priorityDate 2000-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 30.