http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004507886-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 2001-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004507886-A |
| titleOfInvention | Thermal platform for automatic testing with temperature control |
| abstract | A platform and method for supporting a test wafer or packaged integrated circuit (IC) is described. The platform includes a top assembly on which a wafer or IC is mounted. A heat plate is positioned below the top assembly and is in thermal communication therewith. The heat plate is made of a porous heat conductive material. A fluid, such as temperature-controlled air, enters through the porous material of the hot plate and propagates in a radial direction. The temperature of the wafer or IC is controlled by controlling the temperature of the air passing through the hot plate. The plate may be made of copper or reticulated foam, or a sintered metal such as carbon or graphite foam. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018523122-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101468984-B1 |
| priorityDate | 2000-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.