| abstract |
Disclosed is an interconnect structure (10), such as a flip chip structure, having a base pad (14) and a stud (17) formed on the base pad (14) and extending from the base pad (14). The stud (17) and the base pad (14) are formed to be continuous and made of substantially the same conductive substrate. Typically, the solder structure (26) is formed on the stud (17), but the solder structure (26) is exposed for subsequent, reflow mounting to another structure. The present invention relates to integrated circuit packaging. More specifically, it relates to studs (17) and stud and bump structures and processing without standard under bump metallurgy. |