http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004362016-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2d4d8115282cf75bb54e672fbbdb0576 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B42D15-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-01 |
| filingDate | 2003-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9790b590a58af39379546ae60dd11d58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db4430d0647b81577efcfd272634cfe5 |
| publicationDate | 2004-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004362016-A |
| titleOfInvention | IC card and method of manufacturing IC card |
| abstract | [PROBLEMS] To improve chip durability, wafer strength, workability, rust prevention, adhesion, and responsiveness (speed). An IC card having a multilayer structure formed by interposing an adhesive layer between a first sheet material 1 and a second sheet material 2 and providing an IC module having an IC chip in this layer. In the above, the material of the IC chip substrate 100 used for the IC module is made of at least one of Ge, GaAs, SiO 2 , InP, and LiNbO 3 quartz glass. [Selection diagram] FIG. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013202903-A |
| priorityDate | 2003-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.