http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004359855-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2003-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eccadfb415123d1a07209bb40cc07192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e73928cbbf8b2838caf3bb4cb5f067f |
| publicationDate | 2004-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004359855-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (A) an epoxy resin (B) a curing agent (C) a silicone-modified epoxy resin represented by the following average composition formula (1): (Wherein, R 1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R is a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated group, and X is a divalent organic group. K and m are positive numbers satisfying 0 ≦ k ≦ 100, 0 <m ≦ 100, and 0 <k + m ≦ 200, and n is an integer satisfying 0 to 400.) And a semiconductor device encapsulated with a cured product of the epoxy resin composition. The epoxy resin composition of the present invention has excellent moldability, and can provide a cured product having excellent thermal shock resistance and moisture resistance reliability. Further, the semiconductor device sealed with the cured product of the epoxy resin composition of the present invention has excellent thermal shock resistance and moisture resistance reliability, and is particularly useful in industry. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020215975-A1 |
| priorityDate | 2003-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.