http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004352893-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
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filingDate 2003-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc73a44629cb030b859a01cb1183fb1a
publicationDate 2004-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004352893-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract The present invention relates to a semiconductor encapsulation using a yellow coloring material which does not contain a halogen-based flame retardant and an antimony compound, has moldability, flame retardancy, and heat resistance which does not discolor even at high temperatures. An epoxy resin composition and a semiconductor device using the same are provided. SOLUTION: Essential components are (A) an epoxy resin, (B) a phenol novolak resin curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) aluminum hydroxide, and (F) yellow iron oxide. The epoxy resin composition according to claim 1, wherein said epoxy resin composition contains 1 to 20% by weight of said aluminum hydroxide and 0.1 to 3% by weight of said yellow iron oxide with respect to all epoxy resin compositions. An epoxy resin composition for stopping.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011252105-A
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priorityDate 2003-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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