http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004351774-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
filingDate 2003-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_899168adbce26bb7ebec86c003f2c2f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7f078074173f43684b0b17043198c07
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publicationDate 2004-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004351774-A
titleOfInvention Flexible metal laminate and manufacturing method thereof
abstract A flexible metal laminate which suppresses warpage and is suitable for a flip-chip bonding method and a method for manufacturing the same are provided. A flexible metal laminate (1) according to the present invention has a metal layer (3) and two or more thermoplastic resin layers (a first thermoplastic resin layer (4a) and a second thermoplastic resin layer (4b)). The two or more thermoplastic resin layers overlap. The flexible metal laminate 1 of the present invention preferably has 2 to 10 thermoplastic resin layers. Further, it is preferable that the thermoplastic resin constituting each thermoplastic resin layer is the same. Furthermore, in the flexible metal laminate 1 of the present invention, between the metal layer 2 and two or more thermoplastic resin layers (the first thermoplastic resin layer 4a and the second thermoplastic resin layer 4b), It is preferable to have the three-dimensional crosslinked thermosetting resin layer 3. [Selection diagram] Fig. 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4541212-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014198684-A1
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priorityDate 2003-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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