| abstract |
A method of plating tin or a tin alloy on a substrate to prevent whisker formation or reduce the number of whiskers. A metal alloy substrate is coated with a photoresist, exposed to form a pattern, and the exposed photoresist is developed to expose a pattern of the metal alloy substrate. Etch to a depth of 0.5 microns, strip the remaining photoresist to form a patterned metal alloy substrate, and deposit a tin or tin alloy coating thereon to form an article. [Selection diagram] None |