http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004331858-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_238da6669dc2a2b0a326a420ea619b80 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2003-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_350c43d4ef5d5cf3c5fede196753040a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fb780a8fa4687f2514a6d98fb865702 |
| publicationDate | 2004-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004331858-A |
| titleOfInvention | Adhesion method using thermosetting epoxy composition |
| abstract | Provided is a bonding method capable of easily and freely controlling the thickness of an adhesive layer without causing internal defects or sparks in the adhesive even if one of the adherends is metal. An adherend comprising, as a main component, an epoxy resin having two or more epoxy groups, an epoxy composition comprising one or more liquids, which is cured by a curing agent and heat, and one or both of which are metal. In the method of bonding 1 and 2 by a dielectric heating method, the adhesive layer 3 of the thermosetting epoxy composition contains glass beads. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010119836-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012125551-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012136736-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103492505-A |
| priorityDate | 2003-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.