http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004327991-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063303b1f96ac1a50a63c6049fb0b09f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04B10-25 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2004-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40860cbdc9a80e987aac15962ffe90fb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2adef565a831e24697f48057279c84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c574b2d9db9b03e93d6a77216104f004 |
| publicationDate | 2004-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004327991-A |
| titleOfInvention | Low thermal expansion adhesives and encapsulants for low temperature and high power density electronic and photonic device assembly and packaging |
| abstract | A filled composite composition having a coefficient of thermal expansion that closely matches the coefficient of thermal expansion of a semiconductor is provided. The filled composite composition can be used as an encapsulant, underfill material, and potting material in electronic and optical packages exposed to a wide temperature range. The composite includes a matrix and a filler composition. In a preferred embodiment, the matrix is an organic material. The filler composition includes particles of a material having a negative coefficient of thermal expansion. Filler compositions include particles having a wide range of particle sizes. Further, the particles exhibit a non-normal distribution, for example, a log-normal or power-law distribution. The irregular particle size distribution of the particles allows the filler composition to be incorporated into the organic matrix at a high level and has a very low thermal expansion that matches the coefficient of thermal expansion of the semiconductor material in the optical components of the electronic package or optical assembly. This results in a composite with a coefficient of expansion. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020047739-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010514172-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010021429-A |
| priorityDate | 2003-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.