http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004323335-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1dffa57ae641849a5f0c50ea8ab5ea0c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B29-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-035 |
| filingDate | 2003-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12dccc15427ec7e1f98484df8df10238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bcfdd5be72f27231d2e2d437b637bd |
| publicationDate | 2004-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004323335-A |
| titleOfInvention | How to prevent silicon rods from cracking |
| abstract | An object of the present invention is to prevent cracks when a sample is taken from a cut rod, regardless of heat treatment. A cut rod is collected from a polycrystalline silicon rod manufactured by a Siemens method. At one or more locations in the circumferential direction of the outer peripheral surface of the cut rod 1, slits 2 extending from the outer peripheral surface toward the center are formed over the entire length in the longitudinal direction. When the slit 2 is formed, the residual stress in the circumferential direction is released, and even if stress is applied to take a sample, the cut surfaces on both sides sandwiching the slit 2 become free interfaces, and the stress is generated by the deformation. Open. As a result, the occurrence of cracks when collecting a sample is suppressed. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114227958-A |
| priorityDate | 2003-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.