http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004315887-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
filingDate 2003-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a6406ca2e17a46f9e43712a2c10740f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0db62049fa7f4c8c142141ee18e8982
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publicationDate 2004-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004315887-A
titleOfInvention Etching solution composition
abstract [PROBLEMS] To provide an etching solution composition for silver or a silver alloy excellent in etching accuracy. [PROBLEMS] To contain nitric acid, an oxidizing agent other than nitric acid, and water to improve in-plane uniformity in etching. An etchant composition for silver or a silver alloy is provided. Preferred oxidizing agents are ceric ammonium nitrate, hydrogen peroxide, ammonium persulfate, potassium permanganate, having a standard electrode potential (25 ° C., E 0 ) with respect to a standard hydrogen electrode in an aqueous solution of 1.7 V or more. It is at least one selected from the group consisting of periodic acid. This composition can form a uniform pattern on the substrate surface and does not adversely affect the working environment. [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008116933-A
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