http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004305863-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
| filingDate | 2003-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b841dd6a8458ba8c015a73a4b2e039ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84f4c968355229e92a9dbec26ea84e65 |
| publicationDate | 2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004305863-A |
| titleOfInvention | UV curable resin composition and method for producing laminated film |
| abstract | An object of the present invention is to provide a self-assembled microstructure, in which a heat curing step of a thermosetting resin in an insulating smoothing layer forming step or the like is performed as a pre-process of an IC chip interconnection process after the IC chip is assembled. Provided is an ultraviolet-curable resin composition for use in manufacturing a laminated film having a microstructure self-assembling function capable of suppressing a change in physical properties, and a method for producing the laminated film using the composition and a laminated film. An ultraviolet curable resin composition laminated on a cyclic olefin resin film as a lower layer material to form a cured film as an upper layer material, wherein a photopolymerization initiator contained in the composition is benzophenone. An initiator comprising a specific polybenzophenone compound having two or more structures in one molecule. Further, a laminated film using the composition as a molding layer is provided. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105315387-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102838694-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007107667-A1 |
| priorityDate | 2003-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.