http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004304006-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44b2ac87aeadb161b83426d9cf6c4bdc |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 |
filingDate | 2003-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59f164a6daf0346778c76533ec4e8f57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f092398fb2a1038ae8ff8bacc9731ace |
publicationDate | 2004-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2004304006-A |
titleOfInvention | Method of manufacturing laminate unit for multilayer ceramic electronic component |
abstract | An object of the present invention is to prevent deformation and destruction of a ceramic green sheet and prevent a solvent in an electrode paste from permeating into the ceramic green sheet. A step of forming a ceramic green sheet (2) on the surface of a first support sheet (1), a step of forming a release layer (5) on the surface of a second support sheet, and a step of Forming a spacer layer 7 in a pattern complementary to the electrode layer while forming the electrode layer 6 in a pattern; forming an adhesive layer 10 on the surface of the third support sheet; Transferring the adhesive layer formed on the support sheet to the surface of the ceramic green sheet; removing the third support sheet from the adhesive layer; and forming the electrode layer on the surface of the second support sheet. And a method of manufacturing a multilayer unit for a multilayer ceramic electronic component, which comprises a step of bringing a surface of a spacer layer and a surface of an adhesive layer into close contact with each other, applying pressure, and bonding. [Selection] Fig. 9 |
priorityDate | 2003-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.