http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004300173-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2003-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f27808cdbccbc0fc0bc792074374c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac60d6180293211b7778093c1cffdd9c |
| publicationDate | 2004-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004300173-A |
| titleOfInvention | Photocurable / thermosetting resin composition and printed wiring board using the same |
| abstract | An object of the present invention is to provide a photocurable and heat-curable material which has high curability in the deep part at the time of exposure, provides high resolution, and has excellent heat resistance, chemical resistance, electrical properties, moisture absorption resistance, and electroless plating resistance. An object of the present invention is to provide a curable resin composition and a printed wiring board excellent in crack resistance in which a photopolymerization initiator is less likely to grow in a thermal cycle test in which quenching and heat absorption are repeated. (A) a carboxyl group-containing resin having one or more carboxyl groups in one molecule; (B) a photopolymerization initiator represented by the following formula (I); (C) a photopolymerization initiator represented by the following general formula (II): (D) a sensitizer represented by the following general formula (III), (E) a reactive diluent, and (F) an epoxy compound having two or more epoxy groups in one molecule. A photo-curable / thermo-curable resin composition to be contained. Embedded image In the formula (II), X represents an oxygen atom, a sulfur atom or a carbonyl group, one or two of R 1 to R 8 represent a hydrogen atom, a halogen atom or a C 1 to C 4 alkyl group, and the rest represent a hydrogen atom. Show. In the formula (III), R 9 and R 10 each independently represent a C 1 to C 3 alkyl group, and R 11 represents a C 1 to C 13 alkyl group or a C 2 to C 13 alkoxyalkyl group. . [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9726975-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015045685-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017110083-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014117496-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108794315-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108794315-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015109878-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017110083-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103969947-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011075923-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103969947-B |
| priorityDate | 2003-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 195.