http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004296723-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
| filingDate | 2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cbba6bf1571c4b93126dedfe2f2af60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f12165abb006408571890d3a2f4d6280 |
| publicationDate | 2004-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004296723-A |
| titleOfInvention | Semiconductor element storage package and semiconductor device |
| abstract | An object of the present invention is to effectively dissipate heat generated when a semiconductor element operates into the atmosphere. A heat radiating member having a mounting portion for a semiconductor element and an insulating frame having wiring conductors attached to an upper surface thereof are provided. The heat radiating member includes the heat radiating member and the insulating frame. A semiconductor element housing package 8 in which a sealing resin 10 for sealing the semiconductor element 11 is injected into the concave portion 5a. The heat radiation member 1 is formed by mounting a copper on a mounting portion of a base 2 made of a matrix of tungsten or molybdenum and copper. And a copper layer 4 is bonded to upper and lower surfaces of a portion where the penetrating metal body 3 is buried, and the cross-sectional area of the penetrating metal body 3 is closer to the center of the base 2. And gradually increases toward the junction with the copper layer 4. The heat conduction of the heat radiating member 1 is good and the contact surface with the semiconductor element 11 can be made smooth, so that the heat generated by the semiconductor element 11 can be satisfactorily radiated to the outside or the atmosphere. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014107542-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103841750-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007049154-A |
| priorityDate | 2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.