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filingDate 2003-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d62675daf345f57e5625e05d93d51cc9
publicationDate 2004-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004296390-A
titleOfInvention Electron source substrate manufacturing device, electron source substrate and image display device
abstract Provided is an electron source substrate manufacturing apparatus capable of stably manufacturing an electron source substrate having high-quality, high-accuracy, and highly reliable electron-emitting devices without clogging at the time of injection. In an electron source substrate manufacturing apparatus, a droplet of a solution for forming a conductive thin film 4 between a plurality of pairs of element electrodes 2 and 3 on a substrate 1 is ejected by a droplet ejecting head having an ejection opening diameter of 25 μm or less, A surface conduction electron-emitting device group is formed. The solution for forming the conductive thin film 4 is a solution in which metal fine particles are dispersed in a liquid. The metal fine particles are made of a material softer than the member constituting the discharge port. In this case, 0.0001 ≦ Dp / Do ≦ 0.01. The surface conduction electron-emitting device to be formed has a structure in which the electron-emitting portion 5 is formed by arranging droplet dots in a line, and the droplet dots are formed by uniform droplets, and the dots are formed alone. When the dot diameter is Ld, the dot diameter is Ld / 2 or less. [Selection diagram] Fig. 1
priorityDate 2003-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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