http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004292700-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01c1e0bc0628f76dea731cda5a666ca1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate | 2003-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44ffba58b85049e3a365e48975fa3406 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e5cb15076b0ad0c9184c9d2450a8e6d |
| publicationDate | 2004-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004292700-A |
| titleOfInvention | Semiconductor mounting film substrate and semiconductor package obtained therefrom |
| abstract | An object of the present invention is to provide a polyimide film for semiconductor mounting which has no elongation, does not warp or curl in a process of processing into a TAB tape or a flexible printed board, and has a high heat-resistant temperature at the time of solder reflow in a semiconductor mounting process. The purpose is to provide. An average linear expansion coefficient at 50 to 200 ° C. is 15 to 30 ppm, and a difference Δn between an average orientation axis direction in a film plane and a refractive index in a thickness direction is 0.17 or less. The above problem can be solved by a polyimide film. |
| priorityDate | 2003-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.