| abstract |
(A) 100 parts by weight of a curable silicone resin having a number average molecular weight of 100 or more; (B) 5 to 50 parts by weight of a micelle-forming surfactant, (C) A composition for forming a porous membrane, comprising as an essential component 0.01 to 10 parts by weight of a compound capable of generating an acid by thermal decomposition. The composition for forming a porous film of the present invention has excellent storage stability. By using this composition, it is porous, low dielectric constant, flat and uniform, and has a small dielectric constant. It is. In addition, the mechanical strength is large, and when used for manufacturing a semiconductor device, it is possible to form an optimal film as an interlayer insulating film. [Selection diagram] Fig. 1 |