http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004285317-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885 |
| publicationDate | 2004-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004285317-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | The present invention provides an epoxy resin composition having excellent solder resistance that does not cause peeling from a lead frame in a soldering process after moisture absorption, and a semiconductor device. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a thiazoline compound, more preferably a thiazolyl compound represented by the general formula (1) An epoxy resin composition for encapsulating a semiconductor, comprising: (Wherein, R1 and R2 are a hydrogen atom, an amino group, a mercapto group, a hydroxyl group, or an organic group containing them, and may be the same or different from each other. However, both R1 and R2 are hydrogen atoms. (Except for compounds having a ring structure of four or more members other than thiazoline ring.) [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005263878-A |
| priorityDate | 2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.