http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004283905-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4a905ddd30c3dbadc6aa088b17ddf4f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
filingDate 2003-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef9b197c7d5e309192a254f2447764f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_500003dafadac056e6af186bac4873f6
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publicationDate 2004-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004283905-A
titleOfInvention Flux solder flux and lead-free solder containing it
abstract An object of the present invention is to provide a flux excellent in scattering prevention and wet spreading when soldering using lead-free solder. A high-density oxidized polyethylene is used in an amount of 1% by mass or more and less than 10% by mass, and a phenolic antioxidant is used in a concentration of 0.5% by mass or more and 5% by mass or less in order to achieve both prevention of scattering of flux and solder and wettability. Is added. [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104476017-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111055045-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017113776-A
priorityDate 2003-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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