| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2003-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e36d3c54a5c00df512214bc26c70eb37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a830ffb40d96d60483e987df0222c8d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a277334430f1c0b9124b896006431752
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16138324678076211cac4fa7b3ae523b |
| publicationDate |
2004-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004281861-A |
| titleOfInvention |
Film with adhesive for semiconductor device, laminated film with metal foil, adhesive sheet for semiconductor device and semiconductor device using the same |
| abstract |
An adhesive for a semiconductor device having a high elastic modulus at high temperature, high adhesion, and low warpage is provided. A film with an adhesive for a semiconductor device in which an adhesive is laminated on at least one surface of an organic insulating film, wherein the adhesive has a multilayer structure of two or more layers, and the concentration of inorganic fine particles in each layer (% by weight). The ratio t1 / t2 of the thickness t1 of the highest concentration inorganic fine particle resin layer (A) and the thickness t2 of the resin layer (B) having a different inorganic fine particle concentration from the resin layer (A) is 2 <. A film with an adhesive for a semiconductor device, wherein t1 / t2 <100. [Selection diagram] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115124351-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115124351-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011246586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10879208-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010045325-A |
| priorityDate |
2003-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |